March 04, 1999
March Report
LLNL Characterizes New Multilayer Sputter System and Fabricates First Mo/Cu Superconducting Multilayers
The LLNL group has characterized the new multilayer sputter system and has fabricated the first Mo/Cu superconducting multilayers with a range of Cu and Mo thicknesses (and measuring superconducting transitions ranging from 1.14 to 0.12 K). Some cross-contamination between the Mo and Cu targets was observed, and improved baffeling was installed to fix the problem. The superconducting transition of two current devices is within 6 mK. LLNL is part of the Microcalorimeter Integrated Product Team.
MIT Completes Fabrication of First Lot of Resistive Gate CCDs
MIT has completed the layout design for the first test lot of RGCCD wafers, fabricated the first test lot, and measured resistivity. PSU is generating a baseline requirements document for the grating spectrometer camera and has also begun modifying the existing CCD camera facility for evaluation of the prototype CCD chips. Columbia and MIT have identified a new approach to the fabrication of thin, flat grating on silicon wafers using interferometric metrology followed by plasma-assisted chemical etching. MIT, PSU, and Columbia are part of the Grating/CCD Integrated Product Team.
